Zuken Inc. has joined the IBM Research AI Hardware Center as a commercial member and signed an agreement with IBM for joint research on heterogeneous chip integration packaging solutions, crucial for AI accelerator architecture. The collaboration aims to enhance 3-D integrated circuit (3DIC) packaging design and optimize Electronic Design Automation (EDA) workflows.

The IBM Research AI Hardware Center, headquartered at the Albany NanoTech Complex in Albany, NY, is a global research hub focused on developing next-generation chips and systems, including advanced semiconductor packaging to meet AI’s processing and speed requirements. As part of the partnership, Zuken will assist in evaluating IBM’s prototype deep learning accelerator core from digital and analog projects and contribute to material development, process modeling, and integration assembly methods for semiconductor packaging.

The agreement also includes efforts to improve reliability testing, performance simulation, and hardware validation. Zuken’s expertise in system-level design will support innovation in 3DIC heterogeneous integration by enabling a co-design environment for system-on-chip (SoC), package, and printed circuit board (PCB) development.

“Zuken is pleased to collaborate with IBM Research as a member of the AI Hardware Center and joint development partner,” said Kazuhiro Kariya, Zuken’s Senior Managing Executive Officer and CTO. “Our unique system-level design platform supports innovation in 3DIC heterogeneous integration design process by enabling a practical SOC/package/PCB co-design environment. Zuken aims to play an important role in the next-generation high-end device development ecosystem.”

“We are thrilled to be working with Zuken to accelerate chip packaging and AI hardware innovation,” said Jeff Burns, Director of the IBM Research AI Hardware Center. “These advances will play a critical role in unlocking the performance and efficiency needed for the future of AI.”

Zuken continues to invest in R&D for 3DIC packaging design and emphasizes open collaboration with industry consortiums to expand technological capabilities and provide innovative solutions to customers.